Hot Curing System Epoxy potting materials is the encapsulation or potting materials based on epoxy resin as the main ingredients, and added with various kinds of additive, applied with the suitable hardener. They could be divided into RT curing and hot curing through their curing condition. Two component, hot curing epoxy potting materials is the most widely used and maximum type. They have the advantages of low viscosity, easy operation, long pot life, good impregnation, high combination performance, which are specially suitable for high voltage device production. Potting Glue / Casting Glue (Epoxy) CW 5725 / HY 5726 CW 5740 / HY 5741 XB 5721 / XB 5723 CW 2202 / HY 2203 CW 229 / HW 229 CW 1116-1 / XW 1257-1 CW 2122-1 / HY 2123 CW 2205 / HY 2205 CW 8761-1 / HW 8761-1