RT Curing System Epoxy potting materials is the encapsulation or potting materials based on epoxy resin as the main ingredients, and added with various kinds of additive, applied with the suitable hardener. They could be divided into RT curing and hot curing through their curing condition. Two component, RT curing epoxy potting materials is not needed heating and low requirement of equipment when curing, which is easy for application. They are widely used for the potting of low voltage device that is not suitable for hot curing. Compared with hot curing system, the advantages are simple equipment, easy application, and low dependency on equipment and technology. Potting Glue / Casting Glue (Epxoy) XB 5720 / XB 5729 CW 2245 / HY 956 CW 2245 / HY 177 CW 2243-1 / HY 842 CW 2243-2 / HY 842 CW 2243-2 / HY 1872 CW 1302 / HY 1300 CW 177 / HY 177 XB 2252 / XB 2253 Araldite F / CY 221 / HY 842 Araldite DBF / HY 842 MY 740 / HY 956

RT Curing System Huntsman Araldite DBF / HY 842

Araldite DBF / HY 842 low viscosity, unfilled epoxy casting resin system, curing at room temperature.
High filler addition possibility.

APPLICATION:

  • Encapsulating or potting of low voltage and electronic components.

Araldite DBF

  • Appearance: Clear liquid
  • Specific gravity at 25°C: 1.15
  • Viscosity at 25°C (mPa.s): 1350-2000

Aradur HY 842

  • Appearance: Clear liquid
  • Specific gravity at 20°C: 0.95
  • Viscosity at 25°C (mPa.s): 400-700

APPLICATION:

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