PU Adhesive
PU adhesive has (－NHCOO－) and (－NCO) in it’s molecular chain. Main advantages of two component PU adhesive:
– Good water resistance.
– High boding strength.
– Good low temperature resistance, and high temperature resistance.
– Fast curing.
– Easy application.
Main usage: Automobile, Train, Composite, Ship, etc.

MMA Adhesive
Main advantages:
– Excellent impact resistance and fatigue resistance performance, and excellent UV resistance performance.
– High peeling strength.
– RT curing, low exothermic, gap filling.
– Wide temperature range for application.
– Environment friendly adhesive.
Easy operation.
Main usage: Automobile, Train, Composite, War industry, Ship, Electronics, Sports, etc.

1936 Dr. Pierre Castan first synthesized epoxy resin adhesive in the laboratory.
1946 Araldite® was put on the market as the world’s first epoxy resin adhesive brand.
1951 Araldite® was used in the assembly of the Comet “Comet” passenger plane.
1955 Araldite® launched the first household adhesive product (DIY) packed with toothpaste
Decades have passed, Araldite® DIY adhesives have been active in industrial and household bonding and sealing due to their superior performance, ease of use, and multiple selectivity.
Araldite®-Provide a comprehensive solution for DIY repair

Hot Curing System
Epoxy potting materials is the encapsulation or potting materials based on epoxy resin as the main ingredients, and added with various kinds of additive, applied with the suitable hardener. They could be divided into RT curing and hot curing through their curing condition.
Two component, hot curing epoxy potting materials is the most widely used and maximum type. They have the advantages of low viscosity, easy operation, long pot life, good impregnation, high combination performance, which are specially suitable for high voltage device production.

Potting Glue / Casting Glue (Epoxy)

CW 5725 / HY 5726
CW 5740 / HY 5741
XB 5721 / XB 5723
CW 2202 / HY 2203
CW 229 / HW 229
CW 1116-1 / XW 1257-1
CW 2122-1 / HY 2123
CW 2205 / HY 2205
CW 8761-1 / HW 8761-1

RT Curing System
Epoxy potting materials is the encapsulation or potting materials based on epoxy resin as the main ingredients, and added with various kinds of additive, applied with the suitable hardener. They could be divided into RT curing and hot curing through their curing condition.
Two component, RT curing epoxy potting materials is not needed heating and low requirement of equipment when curing, which is easy for application. They are widely used for the potting of low voltage device that is not suitable for hot curing. Compared with hot curing system, the advantages are simple equipment, easy application, and low dependency on equipment and technology.

Potting Glue / Casting Glue (Epxoy)

XB 5720 / XB 5729
CW 2245 / HY 956
CW 2245 / HY 177
CW 2243-1 / HY 842
CW 2243-2 / HY 842
CW 2243-2 / HY 1872
CW 1302 / HY 1300
CW 177 / HY 177
XB 2252 / XB 2253
Araldite F / CY 221 / HY 842
Araldite DBF / HY 842
MY 740 / HY 956

PU System
The advantages of PU potting materials are low hardness, good elasticity, water resistance, mycete resistance, good dielectric and flame retardancy, and there are no corrosion for devices, which has good adhesion on steel, aluminium, copper, zinc, rubber, plastic and wood. The curing glue could protect devices and PCB from shaking, corrosion, moisture and dust.

Hotmelt is the plastic adhesive, whose physical state will change with temperature change at a certain temperature range, but there is not any change of its chemical characteristics. It is non-toxic and smellless, one type of environment friendly chemical. Polyamide hotmelt is produced through the condensation reaction between dimer scids and polymine, and it has the advantages of good toughness and good bonding strength.