YG6111 is a metal-oxide-filled silicone compound designed to provide superior thermal conductivity. This combination of high purity fillers and silicone results in a smooth, homogeneous, white, high temperature dielectric compound. It has virtually no oil separation or high temperature weight loss and possesses truly outstanding thermal conduction  roperties.
YG6111 is suggested for use in semi-conductor devices, and thermal joints where it maintains a positive seal which improves the heat transfer. This means that electrical and electronic components will perform their function at much lower temperatures, thereby increasing their efficiency and prolonging their life.

• A one-component
• Appearance: White
• Worked penetration (25°C) : 310
• Bleed (150 ºC 24 h(%)): 0.4
• Evaporation (150 ºC 24 h(%)): 0.1
• Thermal conductivity (W/m.k): 0.84
• Volatile siloxane content (D4-D10) (WT%): 0.01
• Features & applications: Intermediate thermal conductivity, low oil separation rate