Momentive organic Silicone
Huntsman Advance Material
Celanese Polymer Emulsions
Heraeus platinum catalyzer
Additive for cutting fluid
Other Chemical
Momentive silicone Potting
Potting glue
Momentive silicone adhesives
Momentive addition curing
Momentive Transparent Silicone

Hot Curing System Epoxy potting materials is the encapsulation or potting materials based on epoxy resin as the main ingredients, and added with various kinds of additive, applied with the suitable hardener. They could be divided into RT curing and hot curing through their curing condition. Two component, hot curing epoxy potting materials is the most widely used and maximum type. They have the advantages of low viscosity, easy operation, long pot life, good impregnation, high combination performance, which are specially suitable for high voltage device production. Potting Glue / Casting Glue (Epoxy) CW 5725 / HY 5726 CW 5740 / HY 5741 XB 5721 / XB 5723 CW 2202 / HY 2203 CW 229 / HW 229 CW 1116-1 / XW 1257-1 CW 2122-1 / HY 2123 CW 2205 / HY 2205 CW 8761-1 / HW 8761-1

Hot Curing System Huntsman Araldite CW 2205 / Aradur HY 2205

READ MORE

APPLICATION:

  • Electricity, electronic

Hot Curing System Huntsman Araldite CW 229 / Aradur HW 229-1

READ MORE

APPLICATION

  • Components are easily processed liquids
  • Adequate working life at processing temperatures
  • Rapid gelation at mold temperatures of 140°C and above
  • Excellent mechanical and electrical properties
  • Excellent fracture toughness characteristics
  • Excellent performance in applications requiring thermal cycling UL® recognized insulation component with Thermal Index of 200°C
Danh mục đang cập nhật thông tin

VIEWED PRODUCTS

No products viewed!

DOWNLOAD

Download

If you want to learn more about the product, please click on the email to download

CONTACT US

CONTACT US

f you want to learn more about the product, please click on the email to download