PU System The advantages of PU potting materials are low hardness, good elasticity, water resistance, mycete resistance, good dielectric and flame retardancy, and there are no corrosion for devices, which has good adhesion on steel, aluminium, copper, zinc, rubber, plastic and wood. The curing glue could protect devices and PCB from shaking, corrosion, moisture and dust.

APPLICATION:

  • Pressure sensitive devices, modules, proximity switches.

APPLICATION:

  • Transformers, filters, capacitors etc.
  • Electrical devices working in potentially explosive environment.
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